New Yorker Electronics is now distributing a heat sink device with enhanced power size ratio, high stability and optimum heat dissipation.
The Tepro TO-220 non-inductive, thick-film heat sink resistor can be used for switching power supplies and various types of pulse circuits.
Miniature device features a plated copper heat sink, a high stability thick-film element and tinned copper leads.
Custom models available with variations in lead length, tolerance to 0.5 percent and temperature coefficients.
Terminal strength tested at a 5lb. pull and solderability and solvent resistance meet MIL-STD-202 requirements.
For more, visit http://www.newyorkerelectronics.com/.