Recently, STMicroelectronics (GENEVA, SWITZERLAND) introduced a new set of antenna-matching companion chips—MLPF-WL-01D3, MLPF-WL-02D3, and MLPF-WL-04D3—designed for STM32WL33 wireless microcontrollers in IoT, smart metering, and remote monitoring applications.
The MLPF-WL-0xD3 chips provide impedance matching and harmonic filtering to improve RF performance and simplify antenna integration with STM32WL33 wireless MCUs.
Features & Benefits:
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Combines impedance matching and harmonic filtering on a single glass substrate.
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Supports both high-band (826–958 MHz) and low-band (413–479 MHz) operation.
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Compatible with high-power (16 dBm/20 dBm) and low-power (10 dBm) output modes.
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Designed for 2-layer or 4-layer PCB implementations.
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Includes integrated antenna protection for streamlined RF connectivity.
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Offers reduced bill-of-materials and board space through integration.
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Maintains performance across temperature changes using non-conductive glass substrate.
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Ultra-compact chip-scale package: 1.47 mm × 1.87 mm × 630 µm.
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Available in seven variants for application-specific optimization.
Suitable for STM32WL33-based designs in smart city, smart agriculture, and industrial applications including smart meters, asset tracking, safety systems, and proximity detection.
For more information, visit the STMicroelectronics webpage.
