Intel, Biden Administration Finalize $7.86 Billion Funding Award Under U.S. CHIPS Act

The award adds to Intel’s $100 billion investment plans.

Intel Ohio One construction site in Licking County, Ohio.
Intel Ohio One construction site in Licking County, Ohio.
Intel

Intel Corporation and the Biden Administration announced that the U.S. Department of Commerce and Intel reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the U.S. CHIPS and Science Act.

The award will support Intel’s previously announced plans to advance critical semiconductor manufacturing and advanced packaging projects at its sites in Arizona, New Mexico, Ohio and Oregon. Intel also plans to claim the U.S. Treasury Department’s Investment Tax Credit, which is expected to be up to 25% of qualified investments of more than $100 billion.

The $7.86 billion is the figure that remains after the Biden administration reduced part the $8.5 billion original funding allotment. The reduction is largely a byproduct of the $3 billion that Intel is also receiving to provide computer chips to the military.

Since the passage of the CHIPS and Science Act more than two years ago, Intel has announced plans to invest more than $100 billion in the U.S. to expand chipmaking and advanced packaging capacity and capabilities critical to economic and national security. The historic investments will support tens of thousands of jobs, strengthen U.S. supply chains, foster U.S.-based R&D and help ensure American leadership in cutting-edge semiconductor manufacturing and technology capabilities.

The award follows the previously signed preliminary memorandum of terms and the completion of Commerce’s due diligence, in addition to the announced investment tax credit. The final total award is less than the proposed preliminary award due to a congressional requirement to use CHIPS funding to pay for the $3 billion Secure Enclave program.

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