An array of light-curing structural adhesive, conformal coating, encapsulating and masking solutions for advanced circuit protection and board-level electronic component assembly will be featured.
Highlighted will be 9771, the first-to-market conformal coating for satellite, missile and space-critical applications to meet NASA ASTM E595 low-outgassing specification.
Other materials to be shown include 9803 low shrinkage cationic epoxy for automotive active alignment and 9037-F encapsulant for chip-on-board, glob-top, chip-on-glass, and wire tacking and bonding.
Of particular interest to engineers involved in ADAS applications, David Dworak, materials scientist for Dymax, will deliver a technical presentation about active alignment adhesive technology on Jan. 27 from noon to 1:30 p.m. during the S36 A3 Interconnection Methods conference track.
Dymax will also exhibit and demonstrate its BlueWave UV/LED light-curing equipment line, including spot, flood and conveyor systems. Technical experts will be on hand to discuss customers' electronics applications in detail.