Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy available from Master Bond (Hackensack, NJ). This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive.
Supreme 3DM-85 forms strong bonds with an extensive range of substrates commonly found in electronics and semiconductors. Substrates include metals, composites, ceramics, silicon and a wide array of plastics. As a single part system, it is easy to handle and offers unlimited working life at room temperature. It is opaque black in color and can be applied manually or automatically. Serviceable from -100°F to +350°F [-73°C to +177°C], Supreme 3DM-85 is available for use in syringes and jars.
www.masterbond.com/industries/adhesives-assembly-electronic-devices, 201-343-8983
